Even if there is an open circuit mode at the beginning of the crack occurrence, it may progress to a short circuit mode while the product is on the market. The short circuit mode may cause problems such as abnormal heat generation or ignition of the MLCC, and so suitable countermeasures are required.
Smart Notebook 14 Product Key Crack
There is a risk that microcracks occurring in the various processes from component mounting to set assembly will progress to ceramic element cracks while the end product is on the market. Special caution is required especially in case of the following applications.Equipment which is constantly exposed to vibrations and/or shocks: equipment of automobiles, railway vehicles and industry, etc.Equipment which is exposed to frequent shock by dropping: mobile devices and smart key, etc.
When excessive stress was continuously applied, cracks occurred in the ceramics element in a standard product. In contrast, with the soft termination product, no cracks were found in the element, though there was a peeling of the nickel layer and the resin layer. This shows that the resin layer has an excellent effect to suppress element cracks.
The drop test was performed assuming mobile applications. In the soft termination product, no cracks occurred even after 10,000 times drop test, thereby this shows that the resin electrode relieved the shock.
Next, the results of the board flexure test is shown. In case of soft termination product, no element cracks were observed in both conventional and low resistance type even after the board was flexed up to 10mm. From the results, it is clear that low resistance type has realized both the board flexure resistance and low electric resistance.
Two capacitors are often mounted in series to decrease the risk of short circuit caused by cracks in battery line. With the safety design product, the serial design in a component acts as the prevention function, therefore the product will contribute to reduce the number of MLCCs. 2ff7e9595c
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